A-PLANE (11-20) SAPPHIRE WAFERS
A plane sapphire wafers have a uniform dielectric constant and highly insulating characteristic, so they are generally used for hybrid microelectronic applications. This orientation can also be used for the growth of high superconductors.
For example, TlBaCaCuO (TbBaCaCuO), Tl-2212, the hetero-epitaxial superconducting thin film is grown on an optical sapphire cerium oxide (CeO2) composite substrate. The availability of Angstrom level surface finishes allows for fine line interconnects of hybrid modules.
Specifications of A-Plane (11-20) Sapphire Wafers
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Item |
2-inch A-plane(11-20) 430μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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Grade |
Prime, Epi-Ready |
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Surface Orientation |
A-plane(11-20) |
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Diameter |
50.8 mm +/- 0.1 mm |
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Thickness |
430 μm +/- 25 μm |
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Primary Flat Orientation |
C-plane(0001) +/- 0.2° |
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Primary Flat Length |
16.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.5 nm (by AFM) |
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(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.5 nm (by AFM) |
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(DSP) |
Back Surface |
Epi-polished, Ra < 0.5 nm (by AFM) |
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TTV |
< 10 μm |
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BOW |
< 10 μm |
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WARP |
< 10 μm |
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Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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25 pieces in one cassette packaging or single piece packaging. |
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Note: Custom sapphire wafers and substrates with any orientation and any thickness can be provided.
Our sapphire wafer cost you less and help you to achieve more, trust us and get a quote now.
If you want to know more about Sapphire substrate, please contact us.
Contact : Zhu Wind, +86 0391 393 3936
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361002 Second hand goodsReport abuse
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361002 Second hand goodsReport abuse
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Quantity : 5000000 - Price : $0.25-5/pc
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- karoplastic
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- 0086 592 5135406
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Application Method 1. Glue is applied on textile or leather. 2. Patterned or fully coated glue is fixed by heat before foil transfer properly. 3. Stamping the foil ,heat: 130C-150C, pressure 4-6 bar, touch time 3-5 s. 4. Discard the carrier film after stamping process.Different...
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