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China 518101 Raw materials
Offer Stressless Thermal Putty Gel

Saturday, July 23, 2016

Thermal Interface Materials including thermal pad, gap filler, gap pad, thermal putty, thermal Gel, EMI absorption thermal materials. Thermal Putty Gel/thermal gap filler: For UAV design and northbridge IC Excellent compressibility Low thermal resistance Good creep performance Location ...

Goldlink Tongda Electronics Co., Ltd

  • 518101 - Baoan
  • 86 755 27579310
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