Offer Stressless Thermal Putty Gel
Details
China Raw materials
Raw materials

Offer Stressless Thermal Putty Gel

Thermal Interface Materials including thermal pad, gap filler, gap pad, thermal putty, thermal Gel, EMI absorption thermal materials.

Thermal Putty Gel/thermal gap filler:

For UAV design and northbridge IC

Excellent compressibility

Low thermal resistance

Good creep performance

Location : Rm616,619, Huafeng Xianan Building, Block45, Baoan, Shenzhen, China, 518101 Baoan,
Contact : Lynn Gui, 86 755 27579310

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Offer Stressless Thermal Putty Gel

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