IPad iPhone4 iNAND LGA52 LGA60 NAND flash memory chip test socket jig fixture, changi...
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China Equipment goods
Equipment goods

IPad iPhone4 iNAND LGA52 LGA60 NAND flash memory chip test socket jig fixture, changi...

Expert maker of IC test socket for 15 years
Shenzhen Kaizhitong Microelectronics Technology is is an international company specialized in the export of all types of electronic components, burn in socket , IC test socket , eMMC socket , eMCP socket , SOP/TSOP/BGA/LGA/QFP/QFN socket , with high quality and competitive prices.

Meeting International Standards
Our products are manufactured under ISO 14001 and ISO 9001 guidelines, and meet UL, CSA, CE and FCC standards.


Aiming at Exceeding Clients' Specifications
Our main manufacturing plant is located in Guangdong, mainland China, and our production line and QC department are always devoted to making perfect products. Our solid expertise and extensive experience in the peripheral and component industry ensure our products will be at or better than the requested specifications.


Cooperate with Us Today
We work side by side with our customers to create a mutually beneficial relationship. We firmly believe in the development of long-term relationships with our customers and vendors, and understand the needs of the markets and how to deliver high-quality and excellent products. We also offer speedy shipping and excellent after-sales support. OEM services are provided. Contact us today.

Hot durable LGA52/60 Apple iNAND test socket with FPC

a) accurate positioning

b) stable performance , long usage life

c) Verify the iNAND good or bad,Change the SN Country Color etc.( Need Software platform support,We don't Provide !!!)

d) easy maintenance , adjustable pressure

Specification :

1. Pogo Pin Solution: beryllium cuprum(standard).

2. Special probe head can stab the oxidation layer of the solder, assuring stable contact and not da maging the solder ball

3. Adopting Torlon As The Insulation Material. Engineering Material.

4. Compatible With LGA60, LGA52,IC Size: 14*18mm 12*18mm.

5. Accurate Positioning On Test Pad or Solder Ball.

6. Long Life Usage(50,000 times), High Quality and Stable Performance.

7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm.

8.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc iNAND chip.

9: Feature: Manual Clamshell, easy to operate.

We're the original manufacturer !!!We have the lowest competitive prices!The shortest processing time guaranteed!!! If you have any inquiry , please contact us freely .

Location : No 14 Factory , 518000 ShenZhen,
Contact : Samuel Lee, +8618926505183

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