EMMC test socket, burn-in socket,11.5x13_0.5mm, for BGA 153 and BGA 169 testing, eMMC...
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EMMC test socket, burn-in socket,11.5x13_0.5mm, for BGA 153 and BGA 169 testing, eMMC...

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

2. Apply to BGA 169 and BGA 153 testing.

3. eMMC data could be read and written fastly.

4. With 30 pins and pin pictch 0.5mm.

5. eMMC size of this product is 11.5x13mm, we also provide other sizes of

12x16mm

14x18mm

12x18mm.

6. Apply to eMMC thickness of 0.8mm and 1.5mm.

7. Accurate positioning on flat bottom pad and solder of eMMC.

8. Life cycle is around 25,000 times.

9. Support flat bottom and solder ball testing.

we're the original manufacturer !!!We have the lowest prices!The shortest processing time guaranteed!!!

Location : No 14 Factory , 518000 ShenZhen,
Contact : Samuel Lee, +8618926505183

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