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Electronics / Computers
PCB Capability |
Item |
PCB Capability |
Layers |
1-8 layers |
Thicker Copper |
1- 4OZ |
Products Type |
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board, BGA& Fine Pitch board |
Solder Mask |
Red, green, yellow, white, blue, black, Matt black |
Base material |
FR4, HI-TG, heavy copper and so on |
Finished Surface |
Conventional HASL, Lead-free HASL, Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold |
Technical Specification |
Minimum line width/gap: 3.5/4mil(laser drill) |
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill) |
|
Minimum Annular Ring: 4mil |
|
Max Copper thickness: 4OZ |
|
Max Production size: 900×1200mm |
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Board Thickness: D/S: 0.2-7.0mm, Multilayers: 0.40-7.0mm |
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Min Solder Mask Bridge: 0.08mm |
|
Aspect ratio: 15: 1 |
|
Plugging Visa capability: 0.2-0.8mm |
|
Tolerance |
Plated holes Tolerance: 0.08mm(min±0.05) |
Non-plated hole tolerance: 0.05min(min+0/-0.05mm or +0.05/-0mm) |
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Outline Tolerance: 0.15min(min±0.10mm) |
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Insulating resistance: 50 ohms (normality) |
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Peel off strength: 1.4N/mm |
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Thermal Stress test: 2650c,20 seconds |
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Solder mask hardness: 6H |
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E-Test voltage: 500V+15/-0V 30S |
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Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
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Silkscreen |
White, Black, None |
Panelization |
V-scoring, |
Tab-routing, |
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Tab-routing with Perforation (Stamp Holes |
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Others |
Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001: 2008 , UL Certificate |
As one of electronics assembly companies, we can offer sorts of related products for sale, if you have needs, please contact us.
More kinds of smt pcb assembly, please visit our website.
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This page is about importers and exporters of PCB Capability Search in a category : Electronics / Computers Search in a category : capability |
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